scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 (See 6.4) 8092 × 9 CMOS static RAM 45 ns 02 (See 6.4) 8092 × 9 CMOS static RAM 35 ns 03 (See 6.4) 8092 × 9 CMOS static RAM 25 ns

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline U C-11 (28-terminal, .560" × .358" × .120"), rectangular chip carrier package X D-10 (28-lead, 1.490" × .610" × .232"), dual-in-line package Y See figure 1 (28-lead, 1.490" × .310" × .120"), dual-in-line package Z F-11 (28-lead, .740" × .380" × .090"), flat package

Supply voltage to ground potential - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC voltage applied to outputs- - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC output current- - - - - - - - - - - - - - - - - - - - - 20 mA Storage temperature range- - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - - - - 1.0 W Lead temperature (soldering, 10 seconds) - - - - - - - - - +300°C Thermal resistance, Junction-to-case (θ_JC): Cases T, U, X, and Z - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Case Y - - - - - - - - - - - - - - - - - - - - - - - - - 28°C/W 1/ Junction temperature (T_J) 2/- - - - - - - - - - - - - - - +150°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High level input voltage (V_IH) - - - - - - - - - - - - - - 2.2 V dc to V_CC + 0.5 V dc Low level input voltage (V_IL) 3/- - - - - - - - - - - - - −1.0 V dcto + 0.8 V dc Case operating temperature range (T_C)- - - - - - - - - - - −55°C to +125°C

intended Use: