scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 1018A Digital-to-analog converter, 275 MWPS, 8-bit, video 02 1018B Digital-to-analog converter, 165 MWPS, 8-bit, video

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and Qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows.

Outline letter Case outline J D-3 (24-lead, 1.290" × .610" × .225"), dual-in-line package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V_EED (measured to V_CCD) - - - - - - - - - - - - - - - −7.0 V dc to +0.5 V dc V_EEA (measured to V_CCA) - - - - - - - - - - - - - - - −7.0 V dc to +0.5 V dc V_CCA (measured to V_CCD) - - - - - - - - - - - - - - - −0.5 V dc to +0.5 V dc CONV, Data, and Controls (measured to V_CCD) - - - - - V_EEA to + 0.5 V dc REF+ (measured to V_CCA) - - - - - - - - - - - - - - - V_EEA to + 0.5 V dc REF− (measured to V_CCA) - - - - - - - - - - - - - - - V_EEA to + 0.5 V dc Lead temperature (soldering, 10 seconds) - - - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - - +175°C Storage temperature - - - - - - - - - - - - - - - - - −60°C to +150°C Power dissipation (P_D) - - - - - - - - - - - - - - - - 1.2 W Thermal resistance, junction-to-ambient (Θ_JA)- - - - - 75.2°C/W Thermal resistance, junction-to-case (Θ_JC) - - - - - - 25°C/W

Negative supply (V_EE) - - - - - - - - - - - - - - - - −5.5 V dc to −4.9 V dc Ambient operating temperature range (T_A) - - - - - - - −55°C to +125°C Reference current (I_SET) - - - - - - - - - - - - - - - 1.105 mA Input capacitance, RHF+ and REF− (C_IN) - - - - - - - - 5 pF (typical) Input capacitance, data and controls (C_INDC) - - - - - 3 pF (typical) Output capacitance (C_OUT) - - - - - - - - - - - - - - 12 pF (typical) Current settling time, clocked mode, (t_S): 2/ To 0.2% - - - - - - - - - - - - - - - - - - - - - - 7 ns (typical) To 0.8% - - - - - - - - - - - - - - - - - - - - - - 5.5 ns (typical) To 0.2%, R_L = 25Ω - - - - - - - - - - - - - - - - - 4.5 ns (typical) Rise time, R_L = 25Ω - - - - - - - - - - - - - - - - - 1 ns (typical) Gain error tempco (A_ET)- - - - - - - - - - - - - - - - 150 ppm/°C (typical) Glitch energy, area = ½ VT (G_E) 2/ - - - - - - - - - - 4 pV-s (typical) Reference bandwidth, −3 dB (BW) 2/ - - - - - - - - - - 1 Mhz (typical)

intended Use: