scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 AD648S Low power, precision, BiFET dual op amp 02 AD648T Low power, precision, BiFET dual op amp

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can P GDIP1-T8 or CDIP2-T8 8 Dual-in-line

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (V_S) ...................................... ±18 V Internal power dissipation: Case G ............................................. 600 mW Case P ............................................. 900 mW Differential input voltage ............................... +V_S and −V_S Output short circuit duration ............................ Indefinite Storage temperature range ................................ −65°C to +150°C Operating temperature range .............................. −55°C to +125°C Lead temperature range (soldering, 60 seconds) ........... +300°C Thermal resistance, junction-to-ambient (θ_JA): Case G ............................................... 150°C/W Case P ............................................... 110°C/W Thermal resistance, junction-to-case (θ_JC): Case G ............................................... 65°C/W Case P ............................................... 22°C/W

Supply voltage (V_S) ...................................... ±18 V Ambient operating temperature range (T_A) ................. −55°C to +125°C

intended Use: