scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54AC10 Triple three-input NAND gate 02 54AC11010 Triple three-input NAND gate

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline C D-1 (14-lead, .785" × .310" × .200"), dual-in-line package D F-2 (14-lead, .390" × .260" × .085"), flat package E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package F F-5 (16-lead, .440" × .285" × .085"), flat package 2 C-2 (20-terminal, .358" × .358" × 100"), square chip carrier package

Supply voltage range 1/ -- - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage 1/ - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc DC output voltage 1/ - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc Clamp diode current - - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - - - ±50 mA DC V_CC or GND current - - - - - - - - - - - - - - - - ±100 mA Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - +260°C Thermal resistance, junction-to-case (θ_JC) - - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) 2/ - - - - - - - - - - - - - +175°C

Supply voltage (V_CC) 3/ - - - - - - - - - - - - - - 3.0 V dc to 5.5 V dc Input voltage - - - - - - - - - - - - - - - - - - - 0.0 V dc to V_CC Output voltage - - - - - - - - - - - - - - - - - - - 0.0 V dc to V_CC Case operating temperature range (T_C) - - - - - - - −55°C to +125°C Input rise or fall times, V_CC = 3.6 V, V_CC = 5.5 V - 0 to 8 ns

intended Use: