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DLA - SMD-5962-92174

MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 1-TO-8 MINIMUM SKEW CLOCK DRIVER, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 8 December 1993
Status: inactive
Page Count: 25
scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-I-38535, Appendix A, specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54AC2525 Minimum skew clock driver

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-I-38535, Appendix A Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835, and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat 2 CQCC1-N20 20 Leadless-chip-carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for device class M, or MIL-I-38535, Appendix A, for device classes B and S, or MIL-I-38535 for device classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (VCC) - - - - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage range (VIN) - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC input diode current (IIK) (VIN = −0.5V to VCC + 0.5 V)- - - - ±20 mA DC output diode current (IOK) (VOUT = −0.5V to VCC + 0.5 V) - - ±20 mA DC output current (IOUT) - - - - - - - - - - - - - - - - - - - - ±50 mA DC VCC or GND current (ICC, IGND) - - - - - - - - - - - - - - - ±400 mA Storage temperature range (TSTG) - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (ΘJC) - - - - - - - - - - - See MIL-STD-1835 Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - +175°C

Supply voltage range (VCC) - - - - - - - - - - - - - - - - - - - +3.0 V dc to +5.5 V dc Input voltage range (VIN) - - - - - - - - - - - - - - - - - - - +0.0 V dc to VCC Output voltage range (VOUT) - - - - - - - - - - - - - - - - - - +0.0 V dc to VCC Maximum low level input voltage (VIL) - - - - - - - - - - - - - 0.90 V dc at VCC = 3.0 V dc 1.08 V dc at VCC = 3.6 V dc 1.35 V dc at VCC = 4.5 V dc 1.65 V dc at VCC = 5.5 V dc Minimum high level input voltage (VIH) - - - - - - - - - - - - - 2.10 V dc at VCC = 3.0 V dc 2.52 V dc at VCC = 3.6 V dc 3.15 V dc at VCC = 4.5 V dc 3.85 V dc at VCC = 5.5 V dc Case operating temperature range (TC)- - - - - - - - - - - - - - −55°C to +125°C Input edge rate (ΔV/Δt) minimum: (VIN from 30% to 70% of VCC) - - - - - - - - - - - - - - - - - 125 mV/ns Maximum low level output current (IOL) - - - - - - - - - - - - - 12 mA at VCC = 3.0 V and 3.6 V dc 24 mA at VCC = 4.5 V and 5.5 V dc Maximum high level output current (IOH) - - - - - - - - - - - - −12 mA at VCC = 3.0 V and 3.6 V dc −24 mA at VCC = 4.5 V and 5.5 V dc

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

Microcircuits... View More

Document History

SMD-5962-92174 REV G
December 12, 2022
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 1-TO-8 MINIMUM SKEW CLOCK DRIVER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Replaceability....
SMD-5962-92174 REV F
August 17, 2021
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 1-TO-8 MINIMUM SKEW CLOCK DRIVER, MONOLITHIC SILICON
Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead...
SMD 5962-92174
January 29, 2019
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 1-TO-8 MINIMUM SKEW CLOCK DRIVER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead finishes are...
SMD 5962-92174
October 18, 2010
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 1-TO-8 MINIMUM SKEW CLOCK DRIVER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD 5962-92174
March 25, 2010
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 1-TO-8 MINIMUM SKEW CLOCK DRIVER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD-5962-92174 REV B
September 22, 2003
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 1-TO-8 MINIMUM SKEW CLOCK DRIVER, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-92174 REV A
February 12, 2003
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 1-TO-8 MINIMUM SKEW CLOCK DRIVER, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-92174
December 8, 1993
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 1-TO-8 MINIMUM SKEW CLOCK DRIVER, MONOLITHIC SILICON
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and...
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References

This document references:
JEDEC JESD 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices
Published by JEDEC on January 1, 1990
This standard describes electrical parameters for this class of CMOS devices.
This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
JEDEC JESD 78 - IC Latch-Up Test
Published by JEDEC on April 1, 2016
This standard covers the I-test and Vsupply overvoltage latch-up testing of integrated circuits. The purpose of this standard is to establish a method for determining IC latch-up characteristics and...
This document references:
MIL-HDBK-103 - LIST OF STANDARD MICROCIRCUIT DRAWINGS
Published by NPFC on March 8, 2021
Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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View All
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