DLA - SMD-5962-87785 REV A
MICROCIRCUIT, LINEAR, WIDEBAND, FAST SETTLING, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 16 May 1994 |
| Status: | inactive |
| Page Count: | 14 |
scope:
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 HA-2541 Fast settling, unity gain stable, wideband operational amplifier 02 EL-2041 Fast settling, unity gain stable, wideband operational amplifier 03 HA-2841 Fast settling, unity gain stable, video operational amplifier
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line P GDIP1-T8 or CDIP2-T8 8 Dual-in-line X See figure 1 12 Can 2 CQCC1-N20 20 Square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Voltage between +V and −V terminals . . . . . . . . . . 35 V dc Differential input voltage (VIN) . . . . . . . . . . . ±6.0 V dc Voltage at either input terminal . . . . . . . . . . . +V to −V Peak output current (< 10% duty cycle) . . . . . . . . 50 mA Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation (PD) . . . . . . . . . . . . 2.0 W 1/ Lead temperature (soldering, 10 seconds): Device types 01 and 02 . . . . . . . . . . . . . . . +275°C Device type 03 . . . . . . . . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (θJC): Cases C, P, and 2 . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Case X . . . . . . . . . . . . . . . . . . . . . . . 82°C/W Thermal resistance, junction-to-ambient (θJA) . . . . . 50°C/W Junction temperature (TJ) . . . . . . . . . . . . . . . +175°C
Positive supply voltage range (+V) . . . . . . . . . . +12 V dc to +15 V dc Negative supply voltage range (−V) . . . . . . . . . . −12 V dc to −15 V dc Common mode input voltage (VCM) . . . . . . . . . . . . < (+V − −V)/2 Load resistance (RL) . . . . . . . . . . . . . . . . . 1.0 kΩ Ambient operating temperature range (TA) . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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