BSI - BS EN 60191-6-4
Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
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| Organization: | BSI |
| Publication Date: | 4 August 2003 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
BS EN 60191-6-4
August 4, 2003
Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
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