scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 TLC3704M Quad, low power, differential voltage comparator

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline C D-1 (14-lead, .785" × .310" × .200"), dual-in-line package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_DD) - - - - - - - - - - - - - - - - - - - −0.3 V dc to 18 V dc Differential input voltage (V_ID) 3/ - - - - - - - - - - - ±18 V dc Input voltage (V_I) - - - - - - - - - - - - - - - - - - - - −0.3 V dc to V_DD Output voltage (V_O) - - - - - - - - - - - - - - - - - - - −0.3 V dc to V_DD Input current (I_I) - - - - - - - - - - - - - - - - - - - - ±5 mA Output current (I_O) (each output) - - - - - - - - - - - - ±20 mA Total current into V_DD terminal - - - - - - - - - - - - - 40 mA Total current out of ground terminal - - - - - - - - - - - 60 mA Storage temperature range - - - - - - - - - - - - - - - - −65°C to 150°C Ambient temperature for 60 seconds: 2 package - - - - - - +260°C Lead temperature soldering, 1.6 mm (0.0625 inch) from case for 60 seconds: C package - - - - - - - - - - - - - - - - - - - - - - - +300°C Power dissipation (P_D), (T_A ≤ +25°C) 4/ - - - - - - - - - 1375 mW Thermal resistance, junction-to-case (Θ_JC) - - - - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) - - - - - - - - - - - - - - - - +150°C

Supply voltage (V_DD) - - - - - - - - - - - - - - - - - - - 4 V dc minimum, 16 V dc maximum Common-mode input voltage (V_IC) - - - - - - - - - - - - - 0 V dc minimum, V_DD −1.5 dc V maximum High level output current (I_OH) - - - - - - - - - - - - - −20 mA maximum Low level output current (I_OL) - - - - - - - - - - - - - - 20 mA maximum Ambient operating temperature (T_A) - - - - - - - - - - - - −55°C to +125°C

intended Use: