scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54LVTH244 3.3-V noninverting octal buffer/driver with bus hold, three-state outputs, TTL compatible inputs.

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) ..................................................... −0.5 V dc to +4.6 V dc DC input voltage range (V_IN) ................................................... −0.5 V dc to +7.0 V dc 4/ DC output voltage range (V_OUT) ................................................. −0.5 V dc to +7.0 V dc 4/ DC output current (I_OL) (per Output) ........................................... +96 mA DC output current (I_OH) (per Output) ........................................... +48 mA5/ DC input clamp current (I_IK) (V_IN < 0.0V) ...................................... −50 mA DC output clamp current (I_OK) (V_OUT < 0.0V) .................................... −50 mA Maximum power dissipation (P_D) ................................................. 500 mW Storage temperature range (T_STG) ............................................... −65°C to +150°C Lead temperature (soldering, 10 seconds) ....................................... +300°C Thermal resistance, junction-to-case (θ_JC) ..................................... See MIL-STD-1835 Junction temperature (T_J) ...................................................... +175°C

Supply voltage range (V_CC) ..................................................... +2.7 V dc to +3.6 V dc Input voltage range (V_IN) ...................................................... 0.0 V dc to +5.5 V dc Minimum high level input voltage (V_IH) ......................................... +2.0 V dc Maximum low level input voltage (V_IL) .......................................... +0.8 V dc Maximum low level output current (I_OL) ......................................... +48 mA Maximum high level output current (I_OH) ........................................ −24 mA Maximum input rise or fall rate (Δt/Δv) (Outputs enabled) ...................... 10 ns/V Case operating temperature range (T_C) .......................................... −55°C to +125°C

intended Use: