scope:

This drawing documents three product assurance class levels consisting of space application (device class V), high reliability (device classes M and Q), and nontraditional performance environment (device class N). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class N, the user is cautioned to assure that the device is appropriate for the application environment.

The PIN is as shown in the following example:

Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 TLC2272M Advanced rail-to-rail dual operational amplifiers 02 TLC2272AM Advanced rail-to-rail dual operational amplifiers with enhanced V_IO

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A N Certification and qualification to MIL-PRF-38535 with a nontraditional performance environment 1/ Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835, JEDEC Publication 95 and as follows:

Outline letter Descriptive designator Terminals Package style Document X MS-0012 AA 8 Plastic small-outline JEDEC Publication 95 P GDIP1-T8 or CDIP2-T8 8 Ceramic dual-in-line MIL-STD-1835 H GDFP1-F10 or CDFP2-F10 10 Ceramic flat pack MIL-STD-1835 2 CQCC1-N20 20 Ceramic square leadless MIL-STD-1835 chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes N, Q, and V or MIL-PRF-38535, appendix A for device class M.

For device class M, plastic encapsulated microcircuits (PEMS) the following manufacturer PIN (see 3.5.1 herein) shall be marked:

Standard 1/ Manufacturer microcircuit PIN drawing PIN 5962-9555201NXD 2272M

Supply voltage range (V_DD+)3/................... +8 V dc Supply voltage (V_DD−............................................ −8 V dc Differential input voltage (V_ID)4/.............. ±16 V dc Input voltage (V_I 3/............................ ±8 V dc Input current (I_I).................................................... ±5 mA Output current (I_O)................................................... ±50 mA Total current into V_DD+............................................... ±50 mA Total current out of V_DD−....................................... ±50 mA Duration of short-circuit current (≤25°C) 5/.... unlimited Continuous total power dissipation (P_D) (≤25°C) 5/ Case X.................................................................... 725 mW Case P.................................................................... 1050 mW Case H.................................................................... 675 mW Case 2.................................................................... 1375 mW Storage temperature range................................................. −65°C to + 150°C Lead temperature (soldering, 10 seconds).................................. +260°C

Supply voltage range (V_DD±) ............................................. ±2.2 V dc min to ±8 V dc max Input voltage range (V_I) .............................................. V_DD− min to V_DD+ - 1.5 V dc max Common mode input voltage (V_IC......................................... V_DD− min to V_DD+ - 1.5 V dc max Operating free-air temperature (T_A).................................... −55°C to + 125°C max

intended Use: