scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Three product assurance classes consisting of space application (device class V), military high reliability (device classes M and Q), and non-traditional military (device class N) with a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". For device class N, the user is cautioned to assure that the device is appropriate for the application environment. When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes N, Q, and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 TLC2272M Advanced rail-to-rail dual operational amplifiers

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 N Certification and qualification to MIL-I-38535 with a non-traditional performance environment 1/ Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835, and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 8 Plastic small-outline package P GDIP1-T8 or CDIP2-T8 8 Ceramic dual-in-line H GDFP1-F10 or CDFP2-F10 10 Ceramic flat pack 2 CQCC1-N20 20 Ceramic square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. For device class N, lead finish shall be in accordance with 1.2.5.1 herein.

Lead finish D shall be designated by a single letter as follows:

Finish Letter Process D Palladium

For device class N, plastic encapsulated microcircuits (PEMS) the following manufacturer PIN (see 3.5.1 herein) shall be marked:

Supply voltage (V_DD+) 3/ . . . . . . . . . . . . . . . . +8 V dc Supply voltage (V_DD−) . . . . . . . . . . . . . . . . . . −8 V dc Differential input voltage (V_ID) 4/ . . . . . . . . . . ±16 V dc Input voltage (V_I) 3/ . . . . . . . . . . . . . . . . . ±8 V dc Input current (I_I) . . . . . . . . . . . . . . . . . . . ±5 mA Output current (I_O) . . . . . . . . . . . . . . . . . . . ±50 mA Total current into V_DD+ . . . . . . . . . . . . . . . . . ±50 mA Total current out of V_DD− . . . . . . . . . . . . . . . . ±50 mA Duration of short-circuit current (≤25°C) 5/ . . . . . . unlimited Continuous total power dissipation (P_D) (≤25°C) 6/ Case X . . . . . . . . . . . . . . . . . . . . . . . . 725 mW Case P . . . . . . . . . . . . . . . . . . . . . . . . 1050 mW Case H . . . . . . . . . . . . . . . . . . . . . . . . 675 mW Case 2 . . . . . . . . . . . . . . . . . . . . . . . . 1375 mW Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . +260°C

Supply voltage (V_DD±) . . . . . . . . . . . . . . . . . . ±2.2 V dc min to ±8 V dc max Input voltage range (V_I) . . . . . . . . . . . . . . . . V_DD− min to V_DD+ − 1.5 V dc max Common mode input voltage (V_IC) . . . . . . . . . . . . . V_DD− min to V_DD+ − 1.5 V dc max Operating free-air temperature (T_A) . . . . . . . . . . . −55°C min to +125°C max

intended Use: