scope:

This drawing documents two product assurance class levels consisting of high reality (device classes Q and M) and Appendix F of MIL-PRF-38535, "General provisions for TAB microcircuits" and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked device meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates of a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 320C40-33 Digital signal processor 02 320C40-40 Digital signal processor 03 320C40-50 Digital signal processor 04 320C40-60 Digital signal processor

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 complaint, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A and Appendix F of MIL-PRF-38535. Q or V Certification and qualification to MIL-PRF-38535 and Appendix F of MIL-PRF- 38535.

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 325 Pin grid array Y See figure 1 352 Quad flat package with non- conductive tie-bar Z See figure 1 325 Tape automated bonds U See figure 1 325 Environmentally protected tape automated bond

The lead finish is as specified in MIL-PRF-38535 and Appendix F of MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A and Appendix F of MIL-PRF-38535 for device class M.

Storage Temperature....................................... −65°C to + 150°C Input voltage............................................. −0.3 V to 7 V Output voltage............................................ −0.3 V to 7 V Supply voltage............................................ −0.3 V to 7 V Power dissipation......................................... 4.7 W Lead temperature (soldering, 10 seconds).................. 260°C Junction temperature (T_J)................................. 150°C Thermal resistance, junction-to-case (θ_JC) Case X ............................................... 3°C/W Case Y ............................................... 2°C/W Maximum die temperature rise for the die at 100% Cases Z and U.......................................... 0.9°C/W

Supply voltage (V_DD) device 0 ..................................... 4.5 V ≤ V_CC ≤ 5.5 V devices 02, 03 and 04 ........................ 4.75 V ≤ V_CC ≤ 5.25 V High level input voltage (V_IH) 2/ X2/CLKIN, [C bar][R bar][D bar][Y bar][X bar][. bar]..... ........................ 2.6 V ≤ V_IH ≤ V_DD + 0.3 V [C bar][S bar][T bar][R bar][B bar][X bar], [C bar][R bar][E bar][Q bar][X bar][, bar] [C bar][A bar][C bar][K bar]X.......................... 2.2 V ≤ V_IH ≤ V_DD + 0.3 V All other pins ............................... 2.0 V ≤ V_IH ≤ V_DD + 0.3 V Low level input voltage (V_IL) 2/ .............. −0.3 ≤ V_IL ≤ 0.8 V High level output current (I_OH) ............... −300 µA Low level output current (I_OL) ................ 2 mA Maximum operating temperature (T_C) devices 01, 02, 03............................ −55°C to + 125°C device 04..................................... −55°C to +100°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)........... XX percent 3/

intended Use: