scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 320C40-33 Digital signal processor 02 320C40-40 Digital signal processor

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 325 pin grid array Y See figure 1 352 Quad flat package with non- conductive tie-bar

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage Temperature . . . . . . . . . . . . . . . . . −65°C to +150°C Input voltage . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V Output voltage . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V Supply voltage . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V Power dissipation . . . . . . . . . . . . . . . . . . 4.7 W Lead temperature (soldering, 10 seconds) . . . . . . 260°C Junction temperature (T_J) . . . . . . . . . . . . . . 150°C Thermal resistance, junction-to-case (Θ_JC) Case X . . . . . . . . . . . . . . . . . . . . . . 3°C/W Case Y . . . . . . . . . . . . . . . . . . . . . . 2°C/W

Supply voltage (V_DD) device 01 . . . . . . . . . . . . . . . . . . . . . 4.5 V ≤ V_CC ≤ 5.5 V device 02 . . . . . . . . . . . . . . . . . . . . . 4.75 V ≤ V_CC ≤ 5.25 V High level input voltage (V_IH) 2/ X2/CLKIN . . . . . . . . . . . . . . . . . . . . . 2.6 V ≤ V_IH ≤ V_DD + 0.3 V CSTRB_X, CRDY_X, CREQ_X, CACK_X . . . . . . . . . . . . 2.2 V ≤ V_IH ≤ V_DD + 0.3 V All other pins . . . . . . . . . . . . . . . . . . 2.0 V ≤ V_IH ≤ V_DD + 0.3 V Low level input voltage (V_IL) 2/ . . . . . . . . . . −0.3 ≤ V_IL ≤ 0.8 High level output current (I_OH) . . . . . . . . . . . −300 µA Low level output current (I_OL) . . . . . . . . . . . 2 mA Maximum operating temperature (T_C) . . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . XX percent 3/

intended Use: