DLA - SMD-5962-95646
MICROCIRCUIT, DIGITAL, ADVANCED BICMOS, 20-BIT BUS-INTERFACE D-TYPE LATCHES WITH TRI-STATE OUTPUTS, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 9 November 1995 |
| Status: | inactive |
| Page Count: | 20 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 54ABT16841 20-bit bus-interface D-type latches with three-state outputs, TTL compatible inputs
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F56 56 Flat package
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input voltage range (VIN) . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +5.5 V dc 4/ DC output current (IOL) (per output) . . . . . . . . . . . . . . . . . . +96 mA DC input clamp current (IIK) (VIN < 0.0 V) . . . . . . . . . . . . . . . −18 mA DC output clamp current (IOK) (VOUT < 0.0 V) . . . . . . . . . . . . . . −50 mA Storage temperature range (TSTG) . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation at TA = +55°C in still air (PD). . . . . . . . 1018 mW 5/
Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Input voltage range (VIN) . . . . . . . . . . . . . . . . . . . . . . . +0.0 V dc to VCC Output voltage range (VOUT). . . . . . . . . . . . . . . . . . . . . . . +0.0 V dc to VCC Maximum low level input voltage (VIL) . . . . . . . . . . . . . . . . . +0.8 V Minimum high level input voltage (VIH) . . . . . . . . . . . . . . . . . +2.0 V Maximum high level output current (IOH). . . . . . . . . . . . . . . . . −24 mA Maximum low level output current (IOL) . . . . . . . . . . . . . . . . . +48 mA Maximum input rise or fall rate (Δt/ΔV). . . . . . . . . . . . . . . . . 10 ns/V Minimum power up ramp rate (Δt/ΔVCC) . . . . . . . . . . . . . . . . . . 200 μs/V Ambient operating temperature range (TA) . . . . . . . . . . . . . . . . −55°C to +125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . XX percent 6/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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