IPC-SM-782
Surface Mount Design and Land Pattern Standard
inactive
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| Organization: | IPC |
| Publication Date: | 1 August 1993 |
| Status: | inactive |
| Page Count: | 228 |
scope:
This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection and testing of those solder joints.
Document History
IPC-SM-782
August 1, 1993
Surface Mount Design and Land Pattern Standard
This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate...
August 1, 1993
Surface Mount Design and Land Pattern Standard
This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate...
August 1, 1993
Surface Mount Design and Land Pattern Standard
This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate...