DLA - SMD-5962-94558

MICROCIRCUIT, DIGITAL, 32-BIT ALU/16-BIT BUS, DIGITAL SIGNAL PROCESSOR, MONOLITHIC SILICON

inactive

Organization:	DLA
Publication Date:	6 June 1994
Status:	inactive
Page Count:	44

scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 320C50A Digital signal processor, 40 MHz 02 320C50A Digital signal processor, 50 MHz

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA2-P141 141 Ceramic pin grid array Y See figure 1 132 Ceramic quad flat package with non-conductive tiebar

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C and considered acceptable and interchangeable without preference.

Supply voltage range (V_DD) 2/ . . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc DC input voltage range (V_IN) . . . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc DC output voltage range (V_OUT) . . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc Storage temperature range (T_STG) . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . +300°C Thermal resistance, junction-to-case (θ_JC) Case X . . . . See MIL-STD-1835 Thermal resistance, junction-to-case (θ_JC) Case Y. . . . . 1.0°C/W Thermal resistance, junction-to-ambient (θ_JA) . . . . . . 39.0°C/W Maximum power dissipation (P_D) T_A = 25°C, V_DD = Max: Device 01 . . . . . . . . . . . . . . . . . . . . . . . 1 W Device 02 . . . . . . . . . . . . . . . . . . . . . . . 1.375 W Junction temperature (T_J) . . . . . . . . . . . . . . . . +175°C

Supply voltage range (V_DD) . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Supply voltage (V_SS) . . . . . . . . . . . . . . . . . . . +0.0 V dc High level input voltage range (V_IH) CLKIN, CLKIN2 . . . . . . . . . . . . . . . . . . . . +3.0 V dc to V_DD + 0.3 V dc CLKX, CLKR, TCLKX, TCLKR . . . . . . . . . . . . . . . +2.5 V dc to V_DD + 0.3 V dc All others . . . . . . . . . . . . . . . . . . . . . . +2.2 V dc to V_DD + 0.3 V dc Low level input voltage range (V_IL) . . . . . . . . . . . −0.3 V dc to 0.6 V dc Maximum high level output current (I_OH) . . . . . . . . . −300 µA Maximum low level output current (I_OL) . . . . . . . . . . +2 mA Input clock frequency range (Device 01) 3/ . . . . . . . . 0 MHz to 40 MHz (Device 02) 3/ . . . . . . . . 0 MHz to 50 MHz Internal clock option capacitors C1, C2. . . . . . . . . . 10 pF Case operating temperature range (T_C) . . . . . . . . . . −55°C ≤ T_C ≤ +125°C Free-air operating temperature (T_A) . . . . . . . . . . . −55°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . XX percent 4/

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

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