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DOD - SMD 5962-90818

MICROCIRCUIT, LINEAR, CURRENT FEED BACK AMPLIFIER, MONOLITHIC SILICON

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Organization: DOD
Publication Date: 8 August 1990
Status: inactive
Page Count: 14
scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified with MIL-I-38535. A dash (-) indicates s non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 EL2030 Current feedback amplifier

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

Device classes M, B, or S case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. Device classes Q and V case outlines shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline C D-1 (14 lead, .785" × .310" × .200"), dual-in-line package 2 C-2 (20 terminal, .358" × .358" × .100") square chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q or V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (VS) - - - - - - - - - - - - - - - - - - - - - ±18 V dc or 36 V dc Input voltage (VIN) - - - - - - - - - - - - - - - - - - - - - ±15 V dc or VS Differential input voltage (VID) - - - - - - - - - - - - - - - ±6 V dc Input current (II) - - - - - - - - - - - - - - - - - - - - - - ±10 mA Maximum power dissipation (PD) - - - - - - - - - - - - - - - - 1.25 W Peak output current (IOP) - - - - - - - - - - - - - - - - - - Short circuit protected Output short circuit duration 1/ - - - - - - - - - - - - - - Continuous Storage temperature range - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - +300°C Junction temperature (TJ) - - - - - - - - - - - - - - - - - - +175°C Thermal resistance, junction-to-case (ΘJC): Case 2 - - - - - - - - - - - - - - - - - - - - - - - - - - +55°C/W Case C - - - - - - - - - - - - - - - - - - - - - - - - - - +35°C/W Thermal resistance, junction-to-ambient (ΘJA): Case C - - - - - - - - - - - - - - - - - - - - - - - - - - 86°C/W Case 2 - - - - - - - - - - - - - - - - - - - - - - - - - - 100°C/W

Supply voltage (VS) - - - - - - - - - - - - - - - - - - - - - ±15 V dc Ambient operating temperature range (TA) - - - - - - - - - - - −55°C to +125°C

Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein.

SPECIFICATIONS MILITARY MIL-M-38510 - Microcircuits, General Specification for. MIL-I-38535 - Integrated Circuits, Manufacturing, General Specification for STANDARDS MILITARY MIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers. MIL-STD-883 - Test Methods and Procedures for Microelectronics. BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMD'S). HANDBOOK MILITARY MIL-HDBK-780 - Standardized Military Drawings

(Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.)

In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence.

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

Microcircuits... View More

Document History

July 15, 2010
MICROCIRCUIT, LINEAR, CURRENT FEED BACK AMPLIFIER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
March 22, 1994
MICROCIRCUIT, LINEAR, CURRENT FEED BACK AMPLIFIER, MONOLITHIC SILICON
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and...
SMD 5962-90818
August 8, 1990
MICROCIRCUIT, LINEAR, CURRENT FEED BACK AMPLIFIER, MONOLITHIC SILICON
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and...

References

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