DOD - SMD 5962-90818
MICROCIRCUIT, LINEAR, CURRENT FEED BACK AMPLIFIER, MONOLITHIC SILICON
| Organization: | DOD |
| Publication Date: | 22 March 1994 |
| Status: | inactive |
| Page Count: | 16 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 EL2030 Current feedback amplifier 02 LM6181 Current feedback amplifier
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VS) . . . . . . . . . . . . . . . . ±18 V dc or 36 V dc Input voltage (VIN) . . . . . . . . . . . . . . . . ±l5 V dc or VS Differential input voltage (VID) . . . . . . . . . ±6 V dc Input current (IIN) . . . . . . . . . . . . . . . . ±10 mA Power dissipation (PD): Cases C and 2 . . . . . . . . . . . . . . . . . . 1.25 W Case P . . . . . . . . . . . . . . . . . . . . . 1 mW Peak output current (IOP) . . . . . . . . . . . . . Short circuit current Output short circuit duration . . . . . . . . . . Continuous 2/ Storage temperature range . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . +300°C Junction temperature (TJ) . . . . . . . . . . . . . +175°C Thermal resistance, junction-to-case (ΘJC): Case C . . . . . . . . . . . . . . . . . . . . . +35°C/W Case P . . . . . . . . . . . . . . . . . . . . . +18°C/W Case 2 . . . . . . . . . . . . . . . . . . . . . +55°C/W Thermal resistance, junction-to-ambient (ΘJA): Case C . . . . . . . . . . . . . . . . . . . . . 86°C/W Case P . . . . . . . . . . . . . . . . . . . . . 114°C/W Case 2 . . . . . . . . . . . . . . . . . . . . . 100°C/W
Supply voltage (VS) . . . . . . . . . . . . . . . . ±15 V dc Ambient operating temperature range (TA) . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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