scope:

This specification establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayer printed wiring boards with or without plated through holes (see 6.1). Verification is accomplished through the use of one of two methods of product assurance (appendix A or appendix B). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

Printed wiring boards are classified by 1.2.1 and 1.2.2.

Printed wiring boards are of the types shown, as specified

Type 1 - Single-sided printed wiring board (see A.6.4.6.1).

Type 2 - Double-sided printed wiring board (see A.6.4.6.2).

Type 3 - Multilayer printed wiring board (see A.6.4.6.3).

The printed wiring board base material type should be identified by the base material designators of the applicable base material specification (see 6.6.5) as required by the master drawing (see 3.1.1).

The main body contains general provisions and is supplemented by detailed appendices. Appendices A and B describe the two product assurance progress that can be implemented by the manufacturer. Appendix A contains the traditional QPL product assurance program. Appendix B is an optional quality management approach using a quality review board concept addressed in MIL-PRF-31032, to modify the generic verification criteria provided in this specification. Appendix C provides statistical sampling, and basic test and inspection procedures. Appendix D is optional and can be used when producing printed wiring boards designed to superseded design standards (see 6.4.1). Appendix D may also be used as a guide in developing a test plan for legacy or existing designs based on the tests and inspections of appendix A. Appendix E is optional and describes an alternative procedure used to evaluate oxidation levels on solderable surfaces. The procedure involves using electrochemical reduction techniques to determine the type and quantity of oxide on plated-through holes. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Defense Supply Center Columbus ATTN: DSCC-VAC, 3990 East Broad Street, Columbus, OH 43213-1152 by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

intended Use: