NPFC - MIL-P-55110
PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
|Publication Date:||22 December 1993|
This specification establishes the qualification and performance requirements for rigid single-sided printed wiring boards, rigid double-sided printed wiring boards, and rigid multilayer printed wiring boards with plated through holes (see 6.1).
Printed wiring boards shall be of the types shown, as specified.
Type 1 - Single-sided board. Type 2 - Double-sided board. Type 3 - Multilayer board.
This test method describes the method and procedure used to evaluate oxidation levels on solderable surfaces. The type and quantity of oxides on copper, tin, and lead surfaces have a significant impact on solderability. The procedure involves using electrochemical reduction techniques to determine the type and quantity of oxide on plated-through holes, attachment lands, and printed wiring board surface conductors. The SERA solderability test method is offered as an alternative to other solderability test methods required by this document. This test method shall not be contractually imposed upon either the contractor or sub-contractor.
Printed wiring boards are intended primarily for use in electronic and electrical equipment to eliminate high density hand wiring, where space is limited and where compact packaging is desirable.... View More
Printed wiring boards are intended primarily for use in electronic and electrical equipment to eliminate high density hand wiring, where space is limited and where compact packaging is desirable. The preservation, packaging, and marking specified herein are intended for direct shipments to the Government. However, this specification may also be used for the preparation of printed wiring boards for shipment from the parts contractor to the original equipment manufacturer.View Less