UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

BSI - BS EN 60286-4

Packaging of Components for Automatic Handling Part 4: Stick Magazines for Electronic Components Encapsulated in Packages of Form E and G

inactive
Buy Now
Organization: BSI
Publication Date: 15 May 1998
Status: inactive
Page Count: 14
ICS Code (Electronic components in general): 31.020
ICS Code (Cases. Boxes. Crates): 55.160

Document History

BS EN 60286-4
November 30, 2013
Packaging of components for automatic handling Part 4: Stick magazines for electronic components encapsulated in packages of different forms
A description is not available for this item.
BS EN 60286-4
May 15, 1998
Packaging of Components for Automatic Handling Part 4: Stick Magazines for Electronic Components Encapsulated in Packages of Form E and G
A description is not available for this item.
BS EN 60286-4
October 31, 1991
Packaging of Components for Automatic Handling Part 4: Stick Magazines for Dual-In-Line Packages
Dimensions and requirements for cases which are meant for transport from the manufacturer of dual-in-line components to the customer and for in-house use in the manufacturing plant.

References

This document references:
IEC 60747-1 - Semiconductor devices – Part 1: General
Published by IEC on August 1, 2010
This part of IEC 60747 gives the general requirements applicable to the discrete semiconductor devices and integrated circuits covered by the other parts of IEC 60747 and IEC 60748 (see Annex A).
This document references:
ISO 11469 - Plastics - Generic identification and marking of plastics products
Published by ISO on October 1, 2016
This International Standard specifies a system of uniform marking of products that have been fabricated from plastics materials. Provision for the process or processes to be used for marking is...
This document references:
IEC 60191-2 - Amendment 16 Mechanical Standardization of Semiconductor Devices - Part 2: Dimensions
Published by IEC on July 1, 2007
A description is not available for this item.
This document is referenced by:
BS EN IEC 61760-3 - Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Published by BSI on March 31, 2021
A description is not available for this item.
This document is referenced by:
BS EN 61188-5-2 - Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components
Published by BSI on October 16, 2003
A description is not available for this item.
This document is referenced by:
BS EN 61760-2 - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Published by BSI on July 31, 2007
A description is not available for this item.
This document is referenced by:
BS EN IEC 61760-1 - Surface Mounting Technology Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by BSI on September 30, 2020
A description is not available for this item.
View Less
View All

Related Products

Searching for related products...

Advertisement