scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device claw V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device types identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 55161 256K × 16-bit multiport video RAM 80 ns 02 55161 256K × 16-bit multiport video RAM 70 ns 03 55161 256K × 16-bit multiport video RAM 75 ns

The device class designator is a single letter identifying the product assurance level as follows:

Device Class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outlines are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA1-68 68 Pin grid array Y See figure 1 64 Flatpack with tie bar

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) ................................ −1.0 V dc to +7.0 V dc Input voltage range ....................................... −1.0 V dc to +7.0 V dc DC short circuit output current ........................... 50 mA Storage temperature range ................................. −65°C to +150°C Maximum power dissipation (P_D) ............................ 1.1 W Lead temperature (soldering, 10 seconds) .................. +260°C Thermal resistance, junction-to-case (Θ_JC): Case X .................................................. See MIL-STD-1835 Case Y .................................................. 15°C/W Junction temperature (T_J) ................................. +175°C

Supply voltage (V_CC) ...................................... 4.5 Vdc to 5.5 V dc Supply voltage (V_SS) ...................................... 0 V Input high voltage (V_IH) .................................. 2.4 V dc minimum to 6.5 V dc maximum Input low voltage (V_IL) ................................... −1 V dc minimum to 0.8 V dc maximum Case operating temperature range (T_C) ..................... −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ............... 4/ percent

intended Use: