scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 CLC409 Op amp, wideband, low distortion

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_CC) . . . . . . . . . . . . . . . . . . . ±7 V dc Common mode input voltage (V_CM) . . . . . . . . . . . . . ±V_CC Differential input voltage . . . . . . . . . . . . . . . . ±10 V dc Output current (I_O) . . . . . . . . . . . . . . . . . . . ±70 mA Power dissipation (P_D) . . . . . . . . . . . . . . . . . . 1.2 W Thermal resistance, junction to ambient (θ_JA) . . . . . . 100°C/W Thermal resistance, junction to case (θ_JC) . . . . . . . . 28°C/W Junction temperature (T_J) . . . . . . . . . . . . . . . . 175°C Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . +300°C

Supply voltage (V_CC) . . . . . . . . . . . . . . . . . . . +5 V dc Gain range . . . . . . . . . . . . . . . . . . . . . . . . ±1 to ±10 Ambient operating temperature range (T_A) . . . . . . . . . −55°C to +125°C

intended Use: