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DLA - SMD-5962-90675

MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY, TTL, 9-BIT BUS INTERFACE FLIP-FLOPS WITH THREE-STATE OUTPUTS, AND INVERTING AND NON-INVERTING OUTPUTS, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 10 April 1991
Status: inactive
Page Count: 18

Document History

SMD 5962-90675
August 22, 2018
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY, TTL, 9-BIT BUS INTERFACE FLIP-FLOPS WITH THREE-STATE OUTPUTS, AND INVERTING AND NON-INVERTING OUTPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD 5962-90675
August 1, 2012
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY, TTL, 9-BIT BUS INTERFACE FLIP-FLOPS WITH THREE-STATE OUTPUTS, AND INVERTING AND NON-INVERTING OUTPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD-5962-90675 REV B
September 2, 2004
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY, TTL, 9-BIT BUS INTERFACE FLIP-FLOPS WITH THREE-STATE OUTPUTS, AND INVERTING AND NON-INVERTING OUTPUTS, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-90675 REV A
October 5, 1992
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY, TTL, 9-BIT BUS INTERFACE FLIP-FLOPS WITH THREE-STATE OUTPUTS, AND INVERTING AND NON-INVERTING OUTPUTS, MONOLITHIC SILICON
This drawing forms a part of a one part - one part number documentation system (see 6.6). Two-product assurance classes, military high reliability (device classes B, Q, and M) and space application...
SMD-5962-90675
April 10, 1991
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY, TTL, 9-BIT BUS INTERFACE FLIP-FLOPS WITH THREE-STATE OUTPUTS, AND INVERTING AND NON-INVERTING OUTPUTS, MONOLITHIC SILICON
A description is not available for this item.

References

This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
MIL-HDBK-103 - LIST OF STANDARD MICROCIRCUIT DRAWINGS
Published by NPFC on March 8, 2021
Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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