scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6). Two-product assurance classes, military high reliability (device classes B, Q, and M) and space application (device class S and V) and a choice of case outlines and lead finishes are available and are reflected in the Part of Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the complete PIN.

The PIN shall be as shown in the following example:

Device class M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54ALS29823 9-bit bus interface flip flops with three-state outputs and noninverting inputs 02 54ALS29824 9-bit bus interface flip flops with three-state outputs and inverting inputs

This device class designator shall be a single letter identifying the product assurance level (see 6.7) as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38610 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline K F-6 (24-lead, .640" × .420" × .090"), flat package L D-9 (24-lead 1.280" × .310" × .200"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_CC) - - - - - - - - - - - - - - - 0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - - 1.2 V dc at −18 mA to +5.5 V dc Voltage applied to a disabled three-state output −0.5 V dc to +5.5 V dc Storage temperature range - - - - - - - - - - - - −65°C to +150°C Continuous power dissipation (P_D) 2/ - - - - - - - 632.5 mW Lead temperature (soldering, 10 seconds) - - - - - 300°C Junction temperature (T_J) - - - - - - - - - - - - +175°C Thermal resistance, junction-to-case (θ_JC) - - - - See MIL-M-38510, appendix C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Maximum high level input voltage (V_IH) - - - - - - - 2.0 V dc Maximum low level input voltage (V_IL) - - - - - - - 0.8 V dc Maximum high level output current (I_OH) - - - - - - −18 mA Maximum low level output current (I_OL) - - - - - - - 32 mA Operating temperature range (T_C) - - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - XX percent 3/

intended Use: