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This specification covers established reliability, ceramic dielectric, multiple layer, chip capacitors. Capacitors covered by this specification have failure rate levels ranging from 1.0 to 0.001 percent per 1,000 hours. These failure rate levels are established at a 90-percent confidence level and maintained at a 10-percent producer's risk and are based on life tests performed at maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature. A part per million (PPM) quality system is used for documenting and reporting the average outgoing quality of capacitors supplied to this specification. Statistical Process Control (SPC) techniques are required in the manufacturing process to minimize variation in production of capacitors supplied to the requirements of this specification.

The type designation shall be in the following form and as specified (See 3.1).

The style is identified by the three-letter symbol "CDR" followed by a two-digit number. The letters-identify established reliability, ceramic dielectric, fixed, chip capacitors, and the number identifies the dimensions of the capacitor. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: US Army Laboratory Command, ATTN: SLCET-R-S, Fort Monmouth, NJ 07703-5302, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of the document or by letter.

The rated temperature and voltage-temperature limits are identified by a two-digit symbol. The first letter "B" indicates the rated temperature of −55°C to +125°C; the second letter indicates the voltage-temperature limits as shown in table I. TABLE I. Voltage-temperature limits.

Symbol Capacitance change with reference to +25°C Steps A to D incl Steps E to G incl. of table XIV of table XIV ---------------------------------------------------------------------- G 90 ±20 PPM/°C 90 ±20 PPM/°C P 1/ 0 ±30 PPM/°C 0 ±30 PPM/°C X +15 −15 percent +15 −15 percent 1/ At measurement point F of table XIV, the capacitance measurement may be ±0.1 percent or ±0.05 pF, whichever is greater, from the +25°C reference.

The nominal capacitance value expressed in picofarads (pF) is identified by a three-digit number; the first two digits represent significant figures and the last digit specifies the number of zeros to follow. When the nominal value is less than 10 pF, the letter "R" shall be used to indicate the decimal point and the succeeding digit(s) of the group shall represent significant figure(s). For example, IRO indicates 1.0 pF and OR5 indicates 0.5 pF.

The rated voltage for continuous operation at +125°C is identified by a Single letter as shown in table II. TABLE II. Rated voltage.

Symbol Rated voltage ------------------------ A 50 B 100 C 200 D 300 E 500 F 1000 G 2000 H 3000 J 4000

The capacitance tolerance is identified by a single letter as shown in table III. TABLE III. Capacitance tolerance.

Symbol 1/ Capacitance tolerance (±) -- B .10 pF C .25 pF D .50 pF F 1 percent G 2 percent J 5 percent K 10 percent M 20 percent 1/ Symbols B, C, and D are applicable for capacitance values of less than 10 pF only. For capacitance values of .10 pF through .50 pF, the capacitance shall never be zero.

The termination finish is identified by a single letter as shown in table IV. TABLE IV. Termination finish.

Symbol Finish ------------------------------------------------------------------ M Palladium-silver N 1/ Silver-nickel-gold P Silver-copper-gold Q Palladium-gold Solder coated, final S Solder coated, final T Silver U Base metallization-barrier metal-solder coated 2/ 3/ W Base metallization-barrier metal-tinned (tin/lead alloy, with a minimum of 4 percent lead) 3/ Y Base metallization-barrier metal-tin T100 percent) 3/ 1/ See 6.4.1. 2/ Solder shall have a melting point of +200°C or less. Solder coat thickness shall be a minimum of 60 microinches. 3/ At the option of the user, U, W, and Y termination finishes may be substituted for the other termination finishes.

The failure rate level (based on life tests performed at maximum rated voltage and temperature) is identified by a single letter as shown in table V. TABLE V. Failure rate level.

Symbol Failure rate level (percent per 1,000 hours) ------------------------------------------------------- M 1.0 P 0.1 R 0.01 S 0.001

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