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ARMY - MIL-PRF-55681E

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

inactive
Organization: ARMY
Publication Date: 3 July 1997
Status: inactive
Page Count: 40
scope:

This specification covers the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors. ER capacitors covered by this specification have failure rate levels (FRL) ranging from 1.0 percent to 0.001 percent per 1,000 hours. These FRLs are established at a 90-percent confidence level and maintained at a 10-percent producer's risk and are based on life tests performed at maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature.

The PIN is in the following form, and as specified (see 3.1). Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: U.S. Army Communications-Electronics Command and Fort Monmouth, ATTN: AMSEL-LC-LEO-E-EP, Fort Monmouth, NJ 07703-5023, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document, or by letter.

The style is identified by the three-letter symbol "CDR" followed by a two-digit number. The letters identify non-ER and ER, ceramic dielectric, fixed, chip capacitors.

The rated temperature and voltage-temperature limits are identified by a two-digit symbol. The first letter "B" indicates the rated temperature of −55°C to +125°C; the second letter indicates the voltage-temperature limits as shown in table I. TABLE I.Voltage-temperature limits.

Symbol Capacitance change with reference to +25°C ------------------------------------------------------------- Step A through step Percent Step E through D of table XIII rated step G of table XIII voltage ---------------------------------------------------------------------- G 90 ± 20 ppm/°C 100 90 ± 20 ppm/°C P 1/ 0 ± 30 ppm/°C 100 0 ± 30 ppm/°C R ± 15 percent 100 +15, −40 percent X ± 15 percent 100 +15, −25 percent Z ± 15 percent 60 +15, −45 percent 1/ At measurement point F of table XIII, the capacitance measurement may be ±0.1 percent or ±0.05 pF, whichever is greater, from the +25°C reference.

The nominal capacitance value expressed in picofarads (pF) is identified by a three-digit number, the first two digits represent significant figures and the last digit specifies the number of zeros to follow. When the nominal value is less than 10 pF, the letter "R" is used to indicate the decimal point and the succeeding digit(s) of the group represent significant figure(s). For example, 1RO indicates 1.0 pF and OR5 indicates 0.5 pF.

The rated voltage for continuous operation at +125°C is identified by a single letter as shown in table II. TABLE II. Rated voltage.

Symbol Rated voltage -------------------------- A 50 B 150 C 200 D 300 E 500 F 1,000 G 2,000 H 3,000 J 4,000

The capacitance tolerance is identified by a single letter as shown in table III. TABLE III.Capacitance tolerance.

Symbol 1/ Capacitance tolerance (±) ---------------------------------------- B .10 pF C .25 pF D .50 pF F 1 percent G 2 percent J 5 percent K 10 percent M 20 percent 1/ Symbols B, C, and D are applicable for capacitance values of less than 10 pF only. For capacitance values of .10 pF through .50 pF, the capacitance will never be zero.

The termination finish is identified by a single letter as shown in table IV.

The Product level designator is identified by a single letter as shown in table V.

intended Use:

Ceramic chip capacitors are intended to be used in thin and thick film hybrid circuits where micro-circuitry is indicated for filter by-pass coupling applications, and where variation in... View More

Document History

September 8, 2017
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
Ceramic chip capacitors are intended to be used in thin and thick film hybrid circuits where micro-circuitry is indicated for filter by-pass coupling applications, and where variation in capacitance...
July 12, 2016
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
Ceramic chip capacitors are intended to be used in thin and thick film hybrid circuits where micro-circuitry is indicated for filter by-pass coupling applications, and where variation in capacitance...
July 12, 2016
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
September 3, 2004
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
Ceramic chip capacitors are intended to be used in thin and thick film hybrid circuits where micro-circuitry is indicated for filter by-pass coupling applications, and where variation in capacitance...
September 3, 2004
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
July 10, 2001
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
June 29, 1998
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-PRF-55681E
July 3, 1997
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
This specification covers the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors. ER capacitors...
July 3, 1997
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
July 13, 1994
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
July 13, 1994
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
This specification covers established reliability, ceramic dielectric, multiple layer, chip capacitors. Capacitors covered by this specification have failure rate levels ranging from 1.0 to 0.001...
June 21, 1993
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
June 29, 1992
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
June 14, 1990
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
This specification covers established reliability, ceramic dielectric, multiple layer, chip capacitors. Capacitors covered by this specification have failure rate levels ranging from 1.0 to 0.001...
June 14, 1990
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
October 7, 1985
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
April 5, 1985
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
August 25, 1983
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
November 22, 1982
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
July 30, 1981
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
July 30, 1981
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
April 1, 1977
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
June 17, 1976
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
June 17, 1976
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
June 20, 1975
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.

References

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