scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices. When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table IA herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 (128K × 8) UVEPROM 300 ns 02 (l28K × 8) UVEPROM 250 ns 03 (128K × 8) UVEPROM 200 ns 04 (128K × 8) UVEPROM 170 ns 05 (128K × 8) UVEPROM 150 ns 06 (128K × 8) UVEPROM 120 ns 07 (128K × 8) UVEPROM 90 ns 08 (l28K × 8) UVEPROM 70 ns 09 (128K × 8) UVEPROM 55 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X See figure 1 (32-lead, 1.680" × .605" × .220"), dual-in-line package 2/ 3/ Y C-12 (32-lead, 0.560" × 0.458" × 0.120"), rectangular chip carrier package 2/ Z C-12A (32-lead, 0.560" × 0.458" × 0.075"), rectangular chip carrier package 2/

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature - - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C All input or output voltage with respect to ground - - - - - - - - - −0.6 V dc to V_CC +0.5 V dc Voltage on A9 with respect to ground - - - - - - - - - - - - - - - - −0.6 V dc to +13.0 V dc V_PP supply voltage with respect to ground during programming - - - - - - - - - - - - - - - - - - - - - - - - −0.6 V dc to +13.5 V dc V_CC supply voltage with respect to ground - - - - - - - - - - - - - - −6 V dc to +7.0 V dc Power dissipation (P_D)- - - - - - - - - - - - - - - - - - - - - - - - 330 mW 5/ Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - -. +300°C Thermal resistance, junction-to-case (Θ_JC): Case X - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 40°C/W Case Y and Z - - - - - - - - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - - - +150°C 6/ Endurance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 50 cycles/byte, minimum Data retention - - - - - - - - - - - - - - - - - - - - - - - - - - - 10 years, minimum

Case operating temperature range (T_C) - - - - - - - - - - - - - - - - −55°C to +125°C Supply voltage range (V_CC)- - - - - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - - - - XX percent 7/

intended Use: