scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 (128K × 8) UVEPROM 300 ns 02 (128K × 8) UVEPROM 250 ns 03 (128K × 8) UVEPROM 200 ns 04 (128K × 8) UVEPROM 170 ns 05,10 (128K × 8) UVEPROM 150 ns 06,11 (128K × 8) UVEPROM 120 ns 07,12 (128K × 8) UVEPROM 90 ns 08 (128K × 8) UVEPROM 70 ns 09 (128K × 8) UVEPROM 55 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style 2/ X GDIP1-T32 or CDIP2-T32 32 Dual-in-line Y CQCC1-N32 32 Rectangular leadless chip carrier Z CQCC2-N32 32 Rectangular leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C All input or output voltage with respect to ground - - - - - - - - −0.6 V dc to V_CC +0.5 V dc Voltage on A9 with respect to ground - - - - - - - - - - - - - - - −0.6 V dc to +13.0 V dc V_PP supply voltage with respect to ground during programming - - - - - - - - - - - - - - - - - - - - - - - - −0.6 V dc to +13.5 V dc V_CC supply voltage with respect to ground - - - - - - - - - −0.6 V dc to +7.0 V dc Power dissipation (P_D) - - - - - - - - - - - - - - - - - - - 330 mW 4/ Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (Θ_JC): Case X, Y and Z - - - - - - - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - - - - - +150°C 5/ Endurance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 50 cycles/byte, minimum Data retention - - - - - - - - - - - - - - - - - - - - - - - - - - 10 years, minimum

Case operating temperature range (T_C) - - - - - - - - - - - - - - −55°C to +125°C Supply voltage range (V_CC) - - - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - - - XX percent 6/