MODUK - DEF STAN 81-77
Packaging of Small Electronic and/or Mechanical Assemblies
| Organization: | MODUK |
| Publication Date: | 31 December 1987 |
| Status: | inactive |
| Page Count: | 17 |
scope:
This INTERIM Standard specifies requirements for the military level packaging of small electronic and/or mechanical assemblies. It is applicable for Levels J, K and L requirements complying with Def Stan 81-41.
This INTERIM Standard shall be applied to items not exceeding 0.5 kg.
This INTERIM Standard shall not be used for the packaging of electronic circuit panels for which Def Stan 81-65 applies.
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