scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54HC03 Quad 2-input NAND gate with open drain outputs

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline C D-1 (14-lead, ¼" × ¾") dual-in-line package 2 C-2 (20-terminal, .350" × .350") square chip carrier package

Supply voltage range - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc DC output voltage - - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc Clamp diode current - - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - - - ±25 mA DC V_CC or GND current (per pin) - - - - - - - - - - - ±50 mA Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) 2/ - - - - - - - - - - 500 mW Lead temperature (soldering, 10 Seconds) - - - - - - - +260°C Thermal resistance, junction-to-case (θ_JC): Case C - - - - - - - - - - - - - - - - - - - - - - - (See MIL-M-38510, appendix C) Case 2 - - - - - - - - - - - - - - - - - - - - - - - 60°C/W 3/ Junction temperature (T_J) - - - - - - - - - - - - - - +175°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - +2.0 V dc to +6.0 V dc Case operating temperature range (T_C) - - - - - - - - −55°0 to +125°C Input rise or fall time: V_CC = 2.0 V - - - - - - - - - - - - - - - - - - - - 0 to 1000 ns V_CC = 4.5 V - - - - - - - - - - - - - - - - - - - - 0 to 500 ns V_CC = 6.0 V - - - - - - - - - - - - - - - - - - - - 0 to 400 ns

intended Use: