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ASTM International - ASTM F542-02

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

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Organization: ASTM International
Publication Date: 10 September 2002
Status: inactive
Page Count: 3
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

1.1 This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.

1.2 This test method provides a means to measure the peak exothermic temperature of an encapsulating compound.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8.

Note 1-There is no equivalent IEC standard.

Document History

May 1, 2007
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)
Heat generated by a reacting liquid encapsulating compound has the potential to cause damage to heat-sensitive electronic components. Degradation of the encapsulating compound has the potential to...
ASTM F542-02
September 10, 2002
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
1.1 This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the...
October 10, 1998
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when...
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