ASTM International - ASTM F542-98
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
|Publication Date:||10 October 1998|
|ICS Code (Mechanical structures for electronic equipment):||31.240|
1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.
1.2 This test method measures the potential heat output of an encapsulating compound under conditions that provide no significant heat sink.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 6.