ASTM International - ASTM F542-07
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)
| Organization: | ASTM International |
| Publication Date: | 1 May 2007 |
| Status: | inactive |
| Page Count: | 3 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
significance And Use:
Heat generated by a reacting liquid encapsulating compound has the potential to cause damage to heat-sensitive electronic components. Degradation of the encapsulating compound has the potential to... View More
scope:
1.1 This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.
1.2 This test method provides a means to measure the peak exothermic temperature of an encapsulating compound.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8.
Note 1
There is no equivalent IEC standard.
Document History
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