scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 (See 6.6) Dual CMOS transceiver

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package 2 C-2 (20-terminal, .358" × .358" × .100"), leadless chip carrier package

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - +6 V dc Positive power supply voltage (+V) - - - - - - - - - - +12 V dc Negative power supply voltage (−V) - - - - - - - - - - −12 V dc Driver input voltage - - - - - - - - - - - - - - - - - −V to +V Receiver input voltage - - - - - - - - - - - - - - - - −30 V dc to +30 V dc Driver output voltage - - - - - - - - - - - - - - - - −V −0.3 V dc to +V +0.3 V dc Receiver output voltage - - - - - - - - - - - - - - - −0.3 V dc to V_CC +0.3 V dc Short circuit duration, driver and receiver outputs - Continuous Power dissipation (P_D) - - - - - - - - - - - - - - - - 500 mW l/ 2/ Thermal resistance, junction-to-case (θ_JC) - - - - - - See MIL-M-38510, appendix C Thermal resistance, junction-to-ambient (θ_JA): Cases E and 2 - - - - - - - - - - - - - - - - - - - 120°C/W Maximum junction temperature (T_J) - - - - - - - - - - +150°C Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - +300°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Ambient operating temperature range (T_A) - - - - - - −55°C to +125°C

intended Use: