scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883. "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 LM199A Precision voltage reference 02 LM199 Precision voltage reference 03 LM199A-20 Precision voltage reference

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X MACY1-X4 4 Can

The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preferences.

Temperature stabilizer voltage (V_H) . . . . . . . . . . 40 V Reverse breakdown current (I_R) . . . . . . . . . . . . 20 mA Forward current . . . . . . . . . . . . . . . . . . . . 1 mA Reference to substrate voltage . . . . . . . . . . . . 40 V Power dissipation (P_D) . . . . . . . . . . . . . . . . 140 mW Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 60 seconds) . . . . . . . +300°C Junction temperature (T_J) . . . . . . . . . . . . . . . +150°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JA) . . . . . 200°C/W

Ambient operating temperature (T_A) . . . . . . . . . . −55°C to +125°C

intended Use: