DLA - MIL-PRF-83504C
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
inactive
| Organization: | DLA |
| Publication Date: | 21 December 2005 |
| Status: | inactive |
| Page Count: | 13 |
scope:
This specification covers the general requirements for dual in-line package (DIP) switches designed for direct insertion into printed circuit boards, plug in sockets components, and panel boards primarily for use in electronic and communications equipment (see 6.1).
intended Use:
Switches covered by this specification are intended for use in low power dc applications. Also, these switches are intended for use on printed circuit boards, and leads may be soldered or inserted... View More
Document History
November 17, 2011
SWITCHES, DUAL IN-LINE PACKAGE (DIP), GENERAL SPECIFICATION FOR
Switches covered by this specification are intended for use in low power dc applications. Also, these switches are intended for use on printed circuit boards, and leads may be soldered or inserted in...
January 7, 2008
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
Switches covered by this specification are intended for use in low power dc applications. Also, these switches are intended for use on printed circuit boards, and leads may be soldered or inserted in...
MIL-PRF-83504C
December 21, 2005
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
Switches covered by this specification are intended for use in low power dc applications. Also, these switches are intended for use on printed circuit boards, and leads may be soldered or inserted in...
December 21, 2005
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
May 16, 2000
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
March 8, 1999
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
June 10, 1997
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
Switches covered by this specification are intended for use in low power dc applications. Also, these switches are intended for use on printed circuit boards, and leads may be soldered or inserted in...
June 10, 1997
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
September 20, 1993
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
December 31, 1990
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
December 31, 1990
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
This specification covers the general requirements for DIP (dual in-line package) switches designed for direct insertion into printed circuit boards, plug in sockets components, and panel boards,...
May 31, 1989
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
January 30, 1984
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
January 28, 1983
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
January 28, 1983
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
August 27, 1982
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
June 18, 1982
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
March 1, 1982
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
April 15, 1977
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
A description is not available for this item.
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