DLA - MIL-PRF-83504B
SWITCHES, DUAL IN-LINE PACKAGE (DIP) GENERAL SPECIFICATION FOR
| Organization: | DLA |
| Publication Date: | 10 June 1997 |
| Status: | inactive |
| Page Count: | 17 |
scope:
This specification covers the general requirements for dual in-line package (DIP) switches designed for direct insertion into printed circuit boards, plug in sockets components, and panel boards primarily for use in electronic and communications equipment (see 6.1).
The style is identified by the four letter symbol, DIPS, followed by a two digit number. The letters identify low current, low voltage, dual in-line switches. The number identifies the design, indicating the basic physical, mechanical, and electrical characteristics of the switch, for example DIPS 02 (see 3.1).
intended Use:
Switches covered by this specification are intended for use in low power dc applications. Also, these switches are intended for use on printed circuit boards, and leads may be soldered or inserted... View More
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