IPC - TM-650 2.6.8B
Thermal Stress, Plated-Through Holes
inactive
| Organization: | IPC |
| Publication Date: | 1 December 1983 |
| Status: | inactive |
| Page Count: | 1 |
Document History
May 1, 2004
Thermal Stress, Plated-Through Holes
This test is performed for the purpose of determining whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly,...
March 1, 1998
Thermal Stress, Plated-Through Holes
A description is not available for this item.
August 1, 1997
Thermal Stress, Plated-Through Holes
A description is not available for this item.
TM-650 2.6.8B
December 1, 1983
Thermal Stress, Plated-Through Holes
A description is not available for this item.