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IPC - TM-650 2.6.8C

Thermal Stress, Plated-Through Holes

inactive
Organization: IPC
Publication Date: 1 August 1997
Status: inactive
Page Count: 2

Document History

May 1, 2004
Thermal Stress, Plated-Through Holes
This test is performed for the purpose of determining whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly,...
March 1, 1998
Thermal Stress, Plated-Through Holes
A description is not available for this item.
TM-650 2.6.8C
August 1, 1997
Thermal Stress, Plated-Through Holes
A description is not available for this item.
December 1, 1983
Thermal Stress, Plated-Through Holes
A description is not available for this item.

References

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