IPC - TM-650 2.6.8C
Thermal Stress, Plated-Through Holes
inactive
Organization: | IPC |
Publication Date: | 1 August 1997 |
Status: | inactive |
Page Count: | 2 |
Document History

May 1, 2004
Thermal Stress, Plated-Through Holes
This test is performed for the purpose of determining whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly,...

March 1, 1998
Thermal Stress, Plated-Through Holes
A description is not available for this item.

TM-650 2.6.8C
August 1, 1997
Thermal Stress, Plated-Through Holes
A description is not available for this item.

December 1, 1983
Thermal Stress, Plated-Through Holes
A description is not available for this item.