scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 LMD18200 3 amp, 55 volt H-bridge

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 24 Dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Total supply voltage at V_CC pins 6 and 7 . . . . . . . 60 V Voltage at pins 3, 4, 5, 9, 10, 15, 16, 17, 21 and 22 . . . . . . . . . . . . . . . . . . . . . . 12 V Voltage at bootstrap pins 1, 12, 13, and 24 . . . . . . V_OUT + 16 V Peak output current (200 ms) . . . . . . . . . . . . . 6 A Continuous output current . . . . . . . . . . . . . . . 3 A Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Power dissipation (P_D) 2/ . . . . . . . . . . . . . . 25 W Power dissipation (P_D) (T_A = +25°C, free air) . . . . . 3 W Lead temperature (soldering, 10 seconds) . . . . . . . +300°C Junction temperature (T_J) . . . . . . . . . . . . . . . +150°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . 1.4°C/W Thermal resistance, junction-to-ambient (Θ_JA) . . . . . 40.5°C/W

Supply voltage (V_CC) . . . . . . . . . . . . . . . . . +12 V to +55 V Ambient operating temperature range (T_A) . . . . . . . −55°C to +125°C

intended Use: