scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class N microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA market devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54ACT112 Dual, negative, edge-triggered, JK, flip-flop with asynchronous set and clear, TTL compatible inputs.

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-18355, and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-Line F GDFP2-F16 or CDFP3-F16 16 Flat 2 CQCC1-N20 or CQCC2-N20 20 leadless chip carrier

The Lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage range (V_IN) - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc DC output voltage range (V_OUT) - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc DC input diode current (I_IK) (0.0 V > V_IN, V_IN > V_CC)- - ±20 mA DC output diode current (I_OK) (0.0 V> V_OUT, V_OUT > V_CC)- ±20 mA DC output current (I_OUT) (per output pin) - - - - - - - +50 mA DC V_CC or GND current (I_CC, I_GND) (per pin) - - - - - - ±200 mA 3/ Storage temperature range (T_STG) - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - - - +175°C Case operating temperature range (T_C) - - - - - - - - - −55°C to +125°C

Supply voltage range (V_CC) - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Input voltage range (V_IN) - - - - - - - - - - - - - - - +0.0 V dc to V_CC Output voltage range (V_OUT) - - - - - - - - - - - - - - +0.0 V dc to V_CC Maximum low level input voltage (V_IL) - - - - - - - - - 0.8 V at V_CC = 4.5 V 0.8 V at V_CC = 5.5 V Minimum high level input voltage (V_IH) - - - - - - - - - 2.0 V at V_CC = 4.5 V 2.0 V at V_CC = 5.5 V Case operating temperature range (T_C) - - - - - - - - - −55°C to +125°C Input rise and fall rate (t_r, t_f) maximum: (from V_IN = 0.8 V to 2.0 V, 2.0 V to 0.8 V) - - - - - 125mV/ns Maximum high level output current (I_OH) - - - - - - - - −24 mA Maximum low level output current (I_OL) - - - - - - - - - 24 mA

Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) - - - - - XX percent 5/

intended Use: