scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 HS303RH Radiation hardened DI Dual SPDT CMOS switch 02 HS307RH Radiation hardened DI Dual SPDT CMOS switch 03 HS390RH Radiation hardened DI Dual SPDT CMOS switch

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C CDIP2-T14 14 Dual-in-line E CDIP2-T16 16 Dual-in-line X CDFP3-T14 14 Flat package Y CDFP4-T16 16 Flat package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage between +V and −V - - - - - - - - - 44 V Supply voltage between +V and ground - - - - - - - 22 V Supply voltage between −V and ground - - - - - - - 22 V Digital input overvoltage: +V_A - - - - - - - - - - - - - - - - - - - - - - +V_SUPPLY + 4 V −VA - - - - - - - - - - - - - - - - - - - - - - −V_SUPPLY − 4 V Analog input overvoltage: +V_S - - - - - - - - - - - - - - - - - - - - - - +V_SUPPLY + 1.5 V −V_S - - - - - - - - - - - - - - - - - - - - - - −V_SUPPLY − 1.5 V Continuous current, S or D - - - - - - - - - - - - 10 mA Peak current, S or D (pulsed at 1 ms, 10 percent duty cycle max) - - - 40 mA Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Maximum package power dissipation at 125°C (P_D)2/ Case outlines C and E - - - - - - - - - - - - - 0.71 W Case outlines X and Y - - - - - - - - - - - - - 0.48 W Thermal resistance, junction-to-case (Θ_JC): Case outlines C and E - - - - - - - - - - - - - 19°C/W Case outlines X and Y - - - - - - - - - - - - - 17°C/W Thermal resistance, junction-to-ambient (Θ_JA): Case outlines C and E - - - - - - - - - - - - - 70°C/W Case outlines X and Y - - - - - - - - - - - - - 105°C/W Lead temperature (soldering, 10 seconds)- - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - +175°C

Operating supply voltage (±V_SUPPLY) - - - - - - - - ±15 V Ambient operating temperature range (T_A) - - - - - −55°C to +125°C Radiation features: Dose rate upset (20 ns pulse) - - - - - - - - - - 3/ Total dose - - - - - - - - - - - - - - - - - - - > 100 Krads (Si) Latch-up 4/ - - - - - - - - - - - - - - - - - - - None

intended Use: