DLA - SMD-5962-91566 REV B
MICROCIRCUIT, DIGITAL, CMOS SINGLE CHIP 8-BIT MICROCONTROLLER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 7 January 1993 |
| Status: | inactive |
| Page Count: | 23 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and H) and space application (device classes S and V) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, Provisions for the use of MIL-STD-883 in conjunction with Compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-N-38510 specified RHA levels and shall be marked with the appropriate RHA designator.Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 1/ 87C751 CMOS 8-bit microcontroller with 2 kilobytes EPROM memory 02 87C751 CMOS 8-bit microcontroller with 2 kilobytes one time programmable EPROM memory 03 1/ 87C751-16 CMOS 8-bit microcontroller with 2 kilobytes EPROM memory 04 87C751-16 CMOS 8-bit microcontroller with 2 kilobytes one time programmable EPROM memory
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.
Outline letter Case outline L 1/ D-9 (24-lead, 1.280" × 0.310" × 0.200"), dual-in-line package 3 1/ C-4 (28-lead, 0.460" × 0.460" × 0.100"), square chip carrier package
The Lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply, voltage range (except P0.2/VPP) - - - - - - −0.5 V to +6.5 V Voltage (any pin) to VSS - - - - - - - - - - - - - −0.5 V dc to +6.5 V dc Voltage from (P0.2/VPP) to VSS - - - - - - - - - - −0.5 V to +13 V Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - - 1.0 W Lead temperature (soldering, 10 seconds) - - - - - +300°C Thermal resistance, junction-to-case (ΘJC) - - - - See MIL-M-38510, appendix C Maximum junction temperature (TJ) - - - - - - - - - +175°C Data retention - - - - - - - - - - - - - - - - - - 10 years minimum
Supply voltage range (VCC) - - - - - - - - - - - - 5.0 V dc ±10 percent Case operating temperature range (TC) - - - - - - −55°C to +125°C Maximum low level input voltage: All (except SDA, SCL) - - - - - - - - - - - - - 0.2 VCC − 0.1 V SDA and SCL - - - - - - - - - - - - - - - - - - 0.3 VCC Minimum high level input voltage: All (except SDA, SCL, X1, and RST) - - - - - - - 0.2 VCC + 1.1 V SDA and SCL - - - - - - - - - - - - - - - - - - 0.7 VCC X1 and RST - - - - - - - - - - - - - - - - - - - 0.7 VCC + 0.2 V Oscillator frequency: (devices 01 and 02) - - - - 3.5 MHz to 12 MHz (devices 03 and 04) - - - - 3.5 MHz to 16 MHz
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - XX percent 2/
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - 90 percent
intended Use:
Microcircuits conforming to this drawing ape intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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