scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54LVT16373 3.3-volt 16-bit transparent D-type latch with three-state outputs, TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certificaton to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDFP1-F48 48 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) ...................................... −0.5 V dc to +4.6 V dc DC input voltage range (V_IN) ................................... −0.5 V dc to +7.0 V dc 4/ DC output voltage range applied to any output in the high state or power-off state (V_OUT) ...................................... −0.5 V dc to +7.0 V dc 4/ DC output current (I_OL) (per output) ............................ +96 mA DC output current (I_OH) (per output) ............................ +48 mA 5/ DC input clamp current (I_IK) (V_IN < 0.0 V) ...................... −50 mA DC output clamp current (I_IK) (V_IN < 0.0 V) ..................... −50 mA Maximum power dissipation (P_D) .................................. 440 mW 6/ Storage temperature range (T_STG) ................................ −65°C to +150°C Lead temperature (soldering, 10 seconds) ........................ +300°C Thermal resistance, junction-to-case (Θ_JC) ...................... See MIL-STD-1835 Junction temperature (T_J) ....................................... +175°C

Supply voltage range (V_CC) ...................................... +2.7 V dc to +3.6 V dc Input voltage range (V_IN) ....................................... 0.0 V dc to +5.5 V dc Output voltage range (V_OUT) ..................................... 0.0 V dc to +5.5 V dc Minimum high level input voltage (V_IH) .......................... +2.0 V Maximum low level input voltage (V_IL) ........................... +0.8 V Maximum high level output current (I_OH) ......................... −24 mA Maximum low level output current (I_OL) .......................... +48 mA Maximum input rise or fall rate (outputs enabled) (Δt/Δt) ....... 10 ns/V Case operating temperature range (T_C) ........................... −55°C to + 125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ................... XX percent 7/

intended Use: