UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

DLA - SMD-5962-87757

MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX D-TYPE FLIP-FLOP WITH MASTER RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 29 November 1988
Status: inactive
Page Count: 13
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54ACT174 Hex D-type, flip-flop with master reset and TTL compatible inputs

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package F F-5 (16-lead, .440" × .285" × .085"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage range 1/ - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage 1/ - - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc DC output voltage 1/ - - - - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc Clamp diode current - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - - ±50 mA DC VCC or GND current (per pin) - - - - - - - - - - ±100 mA Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - +245°C Thermal resistance, junction-to-case (θJC): Cases E, F, and 2 - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) 2/ - - - - - - - - - - - - +175°C

Supply voltage (VCC) - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Input voltage - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Output voltage - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Case operating temperature range (TC) - - - - - - - −55°C to +125°C Input rise or fall times: VCC = 3.6 V to 5.5 V - - - - - - - - - - - - - - - 0 to 8 ns/V

Minimum setup time, Dn to CP (ts): TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - 3.0 ns TC = −55°C to +125°C, VCC = 4.5 V - - - - - - - 3.0 ns Minimum hold time, Dn to CP (th): TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - 2.0 ns TC = −55°C to +125°C, VCC = 4.5 V - - - - - - - 2.5 ns Minimum pulse width CP (tw): TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - 5.0 ns TC = −55°C to +125°C, VCC = 4.5 V - - - - - - - 6.2 ns Maximum frequency (fmax): TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - 95 MHz TC = −55°C to +125°C, VCC = 4.5 V - - - - - - - 80 MHz Minimum pulse width [M bar][R bar] (tw): TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - 5.0 ns TC = −55°C to +125°C, VCC = 4.5 V - - - - - - - 5.0 ns Minimum recovery time, [M bar][R bar] to CP (trem): TC = +25°C, VCC = 4.5 V - - - - - - - - - - - - 1.5 ns TC = −55°C to +125°C, VCC = 4.5 V - - - - - - - 1.5 ns

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

March 11, 2019
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, HEX D-TYPE FLIP-FLOP WITH MASTER RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
March 13, 2017
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, HEX D-TYPE FLIP-FLOP WITH MASTER RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
August 26, 2014
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, HEX D-TYPE FLIP-FLOP WITH MASTER RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
November 29, 2011
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX D-TYPE FLIP-FLOP WITH MASTER RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
April 21, 2005
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX D-TYPE FLIP-FLOP WITH MASTER RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
December 18, 2001
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX D-TYPE FLIP-FLOP WITH MASTER RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-87757
November 29, 1988
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX D-TYPE FLIP-FLOP WITH MASTER RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....

References

Advertisement