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DLA - SMD-5962-02502

MICROCIRCUIT, MEMORY, DIGITAL, CMOS, RADIATION-HARDENED, 3.3 V, 32K X 8-BIT PROM, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 29 October 2001
Status: inactive
Page Count: 18

Document History

SMD-5962-02502 REV C
September 27, 2023
MICROCIRCUIT, DIGITAL, MEMORY, DIGITAL, CMOS, RADIATION-HARDENED, 3.3 V, 32K X 8-BIT PROM, MONOLITHIC SILICON
Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes...
SMD 5962-02502
May 12, 2016
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, RADIATION-HARDENED, 3.3 V, 32K X 8-BIT PROM, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are...
SMD 5962-02502
January 4, 2008
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, RADIATION-HARDENED, 3.3 V, 32K X 8-BIT PROM, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD-5962-02502
October 29, 2001
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, RADIATION-HARDENED, 3.3 V, 32K X 8-BIT PROM, MONOLITHIC SILICON
A description is not available for this item.

References

This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
Published by ASTM on October 1, 2011
This guide defines the requirements and procedures for testing integrated circuits and other devices for the effects of single event phenomena (SEP) induced by irradiation with heavy ions having an...
This document references:
JEDEC JESD 78 - IC Latch-Up Test
Published by JEDEC on April 1, 2016
This standard covers the I-test and Vsupply overvoltage latch-up testing of integrated circuits. The purpose of this standard is to establish a method for determining IC latch-up characteristics and...
This document references:
MIL-HDBK-103 - LIST OF STANDARD MICROCIRCUIT DRAWINGS
Published by NPFC on March 8, 2021
Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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