scope:
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example:
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 54LVTH162245 3.3 V 16-bit bus transceiver with equivalent
22Ω A-port output resistors, three-state
outputs, TTL compatible inputs.
The device class designator is a single letter identifying the product assurance level as follows:
Device class Device requirements documentation
M Vendor self-certification to the requirements for MIL-STD-883 complaint,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V Certification and qualification to MIL-PRF-38535
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
X GDFP1-F48 48 Ceramic dual flat pack
The lead finish is as specified in MIL-PRF-38535 for device class Q and V or MIL-PRF-38535, appendix A for device class M.
Supply voltage range (VCC)..................................................... −0.5 V dc to +4.6 V dc
DC input voltage range (VIN)................................................... −0.5 V dc to +7.0 V dc 4/
DC output voltage range applied to any output in the
high state or power-off state (VOUT).......................................... −0.5 V dc to +7.0 V dc 4/
DC output current (IOL) (per output):
B port......................................................................... +96 mA
A port......................................................................... +30 mA
DC output current (IOH) (per output):
B port......................................................................... +48 mA 5/
A port......................................................................... +30 mA
DC input clamp current (IIK) (VIN < 0.0 V)...................................... −50 mA
DC output clamp current (IOK) (VOUT < 0.0V)..................................... −50 mA
Maximum power dissipation at TA = 55°C (in still air)........................... 1.0 W 6/
Storage temperature range (TSTG)................................................ −65°c to +150°C
Lead temperature (soldering, 10 seconds)........................................ +300°C
Thermal resistance, junction-to-case (ΘJC)..................................... See MIL-STD-1835
Junction temperature (TJ)...................................................... +150°C
Supply voltage range (VCC)...................................................... +2.7 V dc to +3.6 V dc
Minimum high level input voltage (VIH).......................................... +2.0 V
Maximum low level input voltage (VIL)........................................... +0.8 V
Maximum input voltage (VIN)..................................................... +5.5 V dc
Maximum high level output current (IOH):
A port......................................................................... −12mA
B port......................................................................... −24mA
Maximum low level output current (IOL):
A port......................................................................... +12 mA
B port......................................................................... +48 mA
Minimum power-up ramp rate (Δt/ΔVCC)............................................ +200 µs/V
Maximum input rise or fall rate (Δt/Δv)(Outputs enabled)........................ 10 ns/V
Case operating temperature range (TC)........................................... −55°C to +125°C
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) ................................... XX percent 8/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Microcircuits... View More
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing.
Device class Q devices will replace device class M devices.
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