scope:

This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G (lowest high reliability), class H (high reliability), and class K, (highest reliability) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 WS-128K32-120HQ,ACT-S128K32-120PQ SRAM, 128K × 32-bit 120 ns 02 WS-128K32-100HQ,ACT-S128K32-100PQ SRAM, 128K × 32-bit 100 ns 03 WS-128K32-85HQ,ACT-S128K32-85PQ SRAM, 128K × 32-bit 85 ns 04 WS-128K32-70HQ,ACT-S128K32-70PQ SRAM, 128K × 32-bit 70 ns 05 WS-128K32-55HQ,ACT-S128K32-55PQ SRAM, 128K × 32-bit 55 ns 06 WS-128K32-45HQ,ACT-S128K32-45PQ SRAM, 128K × 32-bit 45 ns 07 WS-128K32-35HQ,ACT-S128K32-35PQ SRAM, 128K × 32-bit 35 ns 08 WS-128K32-25HQ,ACT-S128K32-25PQ SRAM, 128K × 32-bit 25 ns 09 WS-128K32-20HQ,ACT-S128K32-20PO SRAM, 128K × 32-bit 20 ns 10 WS-128K32-17HQ,ACT-S128K32-17PQ SRAM, 128K × 32-bit 17 ns

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation D, E, G, H, or K Certification and qualification to MIL-PRF-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style M See figure 1 66 Hex-in-line, single cavity, without standoffs N See figure 1 66 Hex-in-line, single cavity, without standoffs T See figure 1 66 Hex-in-line, single cavity, with standoffs U See figure 1 66 Hex-in-line, single cavity, without standoffs X See figure 1 66 Hex-in-line, single cavity, with standoffs Y See figure 1 66 Hex-in-line, single cavity, without standoffs 4 See figure 1 66 Hex-in-line, single cavity, with standoffs 5 See figure 1 66 Hex-in-line, single cavity, with standoffs

The lead finish shall be as specified in MIL-PRF-38534 for classes H and K.

Supply voltage range (V_CC) ............................. −0.5 V dc to +7.0 V dc Signal voltage range (any pin) .......................... −0.5 V dc to +7.0 V dc Power dissipation (P_D): Device types 01 through 08 ............................ 2.2 W Device type 09 and 10 ................................. 4.4 W Thermal resistance junction-to-case (θJ_C) .............. 6.6°C/W Storage temperature range ............................... −65°C to +150°C Lead temperature (soldering, 10 seconds) ............... +300°C

Supply voltage range (V_CC) .............................. +4.5 V dc to +5.5 V dc Input low voltage range (V_IL) ........................... −0.5 V dc to +0.8 V dc Input high voltage range (V_IH) .......................... +2.2 V dc to V_CC +0.3 V dc Output low voltage, maximum (V_OL) ....................... +0.4 V dc Output high voltage, minimum (V_OH) ..................... +2.4 V dc Case operating temperature range (T_C) .................. −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.