scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 WS-128K32-120HQ SRAM, 128K X 32-bit 120 ns 02 WS-128K32-100HQ SRAM, 128K X 32-bit 100 ns 03 WS-128K32-85HQ SRAM, 128K X 32-bit 85 ns 04 WS-128K32-70HQ SRAM, 128K X 32-bit 70 ns 05 WS-128K32-55HQ SRAM, 128K X 32-bit 55 ns 06 WS-128K32-45HQ SRAM, 128K X 32-bit 45 ns 07 WS-128K32-35HQ SRAM, 128K X 32-bit 35 ns 08 WS-128K32-25HQ SRAM, 128K X 32-bit 25 ns 09 WS-128K32-20HQ SRAM, 128K X 32-bit 20 ns 10 WS-128K32-17HQ SRAM, 128K X 32-bit 17 ns

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation H or K Certification and qualification to MIL-M-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style T See figure 1 66 Hex-in-line, single cavity, with standoffs U See figure 1 66 Hex-in-line, single cavity, without standoffs U See figure 1 66 Hex-in-line, single cavity, with standoffs Y See figure 1 66 Hex-in-line, single cavity, without standoffs

The lead finish shall be as specified in MIL-H-38534 for classes N and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) ........................ −0.5 V dc to +7.0 V dc Signal voltage range (any pin) .................... −0.5 V dc to +7.0 V dc Power dissipation (P_D): Device types 01 through 08 ...................... 2.2 W Device type 09 and 10 ........................... 4.4 W Thermal resistance junction-to-case (θJ_C) ......... 6.6°C/W Storage temperature range ......................... −65°C to +150°C Lead temperature (soldering, 10 seconds) .......... +300°C

Supply voltage range (V_CC) ........................ +4.5 V dc to +5.5 V dc Input low voltage range (V_IL) ..................... −0.5 V dc to +0.8 V dc Input high voltage range (V_IH) .................... +2.2 V dc to V_CC +0.3 V dc Output low voltage, maximum (V_OL) ................. +0.4 V dc Output high voltage, minimum (V_OH) ................ +2.4 V dc Case operating temperature range (T_C) ............. −55°C to +125°C